http://www.optosupply.com ver a.0 t t o o p p s s 6 6 w w w w a a r r m m w w h h i i t t e e c c e e r r a a m m i i c c l l e e d d o o s s 5 5 m m f f 3 3 t t e e c c 1 1 e e ver . 3 features outline dimension high-power led long lifetime operation typical viewing angle : 120deg rohs compliant possible to attach to heat sink directly without using print circuit board. applications indoor & outdoor lighting stage lighting reading lamps display cases, furniture illumination, marker architectural illumination spotlights 6 o j u n n 5 p m f s b o d f ? n n tolerances are for reference only 15.0 +0.5 -0.3 12.0 +0.5 -0.3 absolute maximum rating 5 b
directivity item symbol value unit dc forward current *1 i f 700 ma pulse forward current*2 i fp 1400 ma reverse voltage v r 15 v power dissipation*1 p d 6,720 mw operating temperature topr -30 ~ +85
storage temperature tstg -40~ +100
lead soldering temperature tsol 260
/5sec *1, power dissipation and forward current are the value when the module temperature is set lower than the rating by using an adequate heat sink. *2, pulse width max.10ms duty ratio max 1/10 electrical -optical charac teristics 5 b
forward current derating curve item symbol condition min. typ. max. 6 o j u dc forward voltage v f i f =600ma 9.0 9.6 10.8 v dc reverse current i r v r =15v - - 100 a luminous flux v i f =600ma 580 600 - lm color temperature cct i f =600ma - 3000 - k x i f =600ma - 0.44 - chromaticity coordinates* y i f =600ma - 0.41 - 50% power angle 2 1/2 i f =600ma - 120 - deg note: don?t drive at rated current more than 5s without heat sink for high power series . * tolerance of chromaticity coordinates is + 10% , * tolerance of luminous flux is + 20% led & application technologies 800 700 600 500 0 100 200 300 400 0 20 40 60 100 case temperature, t a (c) forward current, i f (ma) 80
http://www.optosupply.com ver a.0 t t o o p p s s 6 6 w w w w a a r r m m w w h h i i t t e e c c e e r r a a m m i i c c l l e e d d o o s s 5 5 m m f f 3 3 t t e e c c 1 1 e e ver . 3 heat design the following pictures show some measurem ents of mounted 5w led on the heat sink for each board a and b (see fig 1) with using thermograph to make an observation about heat distri bution. each boards is tested at various current conditions. as a result, led needs larger heat sink as much as possible to reduce its own case temperature. fig. 1 configuration pattern examples for board assembly board led power material surface area (m ) min. a 5w al 10,300 b 10w al 20,600 c 25w al 51,500 d 50w al 103,000 e 100w al 206,000 f 200w al 412,000 g 300w al 618,000 above tested led device is attached w ith adhesive sheet to the heatsink. for reference's sake, tj absolute maximum rating is defined at 115 ? as a prerequisite on design process of 5w led. board a (surface area=10,300m ) board b (surface area=20,600m ) if=600ma if=600ma led & application technologies
http://www.optosupply.com ver a.0 t t o o p p s s 6 6 w w w w a a r r m m w w h h i i t t e e c c e e r r a a m m i i c c l l e e d d o o s s 5 5 m m f f 3 3 t t e e c c 1 1 e e ver . 3 heat design ? design flow chart led & application technologies 1. mounting led(s) on the board 2. built-in 2-1. building on to the lighting fixture module. 2-2. setting on the actual using condition 3. how to measure tc 3-1. with using thermo couple. (*a,*b) 3-2. chose the measured led device which assumed the highest tc in the mounted leds. (*b) 3-3. under stable temperature condition. 4. judgment of tc 4-1. not over the temperature of your standard rated ? 4-2. not over the temperature of specified on led device specification sheet ? (see fig.a) 5. implemented above condition *possible to use as it stands. 5. not implemented *reducing forward current *reconsider its design of thermal resistance if not, go back to procedure no.1 and reconsider.
http://www.optosupply.com ver a.0 t t o o p p s s 6 6 w w w w a a r r m m w w h h i i t t e e c c e e r r a a m m i i c c l l e e d d o o s s 5 5 m m f f 3 3 t t e e c c 1 1 e e ver . 3 handling ? manually handling use tweezers to catch hold of leds at the base substrate pa rt. do not touch the lens with the tweezers and fingers. do not press on the lens. led & application technologies
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